3D Model Datasheet SPICE模型 SPICE DCDC Tool

XGL3512 Series

Ultra-Low Loss Shielded Power Inductors

The XGL3512 Series Ultra-Low Loss Shielded Power Inductors deliver performance with low DCR and ultra-low AC losses. They offer effective handling with soft saturation characteristics, adjusting optimally to various load conditions.

Compliant with AEC qualifications, these inductors are built to endure temperatures from -40°C to +125°C, making them ideal for high-stress environments. The wide inductance value of 0.082 to 1.2 µH accommodates diverse applications, enhancing system efficiency.

The XGL3512 Series also offers COTS Plus tin-silver-copper and tin-lead terminations, providing further versatility. Choose Coilcraft's XGL3512 Series for power inductors that combine robustness, efficiency, and flexibility.

Very low DCR and ultra-low AC losses over a wide frequency range
Effective current handling with soft saturation characteristics
AEC-Q200 Grade 1 (−40°C to +125°C)
Wide inductance range from 0.082 µH to 1.2 µH
RoHS-compliant, halogen-free. 260°C compatible. Tin-silver (96.5/3.5) over copper terminations
COTS Plus tin-silver-copper and tin-lead terminations available

Need parts for space, military or other critical applications?
See Coilcraft ST413PGA Series

立即购买:

零件号

查找我的元件

计数	单价
1	$1.88
100	$1.72
250	$1.29
500	$0.77
1000	$0.60
2500	$0.51
5000	$0.47

对于大批量采购或非库存产品，点击这里请求报价。

Tolerance

M = 20%

Termination

E = Tin-silver (96.5/3.5) over copper

Packaging

C = 7" machine-ready reel

. 现货，可今天发货.

索取样品:

零件号

查找我的元件

设计套件:

套件	电感值	价格
C502	11 (3 of each)	$45.00
C509	49 (3 of each)	$125.00

规格

Electrical specifications at 25°C. Operating voltage 0 — 80 V

零件号 1	电感 (µH) 2 (公差: ±20%)	DCR (mΩ) 3		SRF typ (MHz) 4	Isat (A) 5			Irms (A) 6
零件号 1	电感 (µH) 2 (公差: ±20%)	typ	max	SRF typ (MHz) 4	10% drop	20% drop	30% drop	20°C rise	40°C rise
XGL3512-820MEC	0.082	2.8	3.3	340	7.0	11.8	17.3	15.7	21.2
XGL3512-900MEC	0.090	3.3	3.8	330	6.8	11.3	16.4	14.4	19.4
XGL3512-101MEC	0.10	3.5	4.0	305	6.5	10.7	15.2	13.5	18.0
XGL3512-201MEC	0.20	6.3	7.3	175	4.3	7.1	10.0	11.3	15.2
XGL3512-331MEC	0.33	10.8	12.5	135	3.4	5.5	7.8	8.6	11.5
XGL3512-401MEC	0.40	12.3	14.2	125	3.2	5.1	7.1	7.7	11.2
XGL3512-521MEC	0.52	15.5	17.9	105	2.8	4.5	6.4	7.0	9.4
XGL3512-621MEC	0.62	20.7	23.8	90	2.6	4.1	5.7	6.0	8.1
XGL3512-821MEC	0.82	24.5	28.2	80	2.2	3.6	5.1	5.6	7.4
XGL3512-102MEC	1.0	28.0	32.2	70	1.9	3.2	4.5	4.9	6.6
XGL3512-122MEC	1.2	32.5	37.4	60	1.7	2.8	4.1	4.4	5.9

注释

When ordering, please specify termination and packaging codes: e.g. XGL3512-122MEC
Inductance tested at 1 MHz, 0.1 Vrms, 0 Adc.
DCR measured at 25°C on a micro-ohmmeter. For other operating temperatures, use this DCR at Temperature calculator.
SRF measured using an Agilent/HP 4395A or equivalent.
Isat: DC current at 25°C that causes the specified inductance drop from its value without current.
Temperature derating curves.
Irms: Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings. Temperature derating curves.
Irms testing was performed on 0.75 inch wide × 0.25 inch thick copper traces in still air. Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions.

端子:

E = Halogen free component. RoHS compliant tin-silver over copper terminations.
T = RoHS tin-silver-copper (95.5/4/0.5). (Special order, added cost)
S = non-RoHS tin-lead (63/37). (Special order, added cost)

包装:

C = 7″ machine-ready reel. EIA-481 embossed plastic tape (1500 per full reel). Quantities less than full reel available: in tape (not machine ready) or with leader and trailer ($25 charge).
D = 13″ machine-ready reel. EIA-481 embossed plastic tape (5000 per full reel).

环境

环境:

符合RoHS , 无卤素

环境温度范围:

–40°C to +125°C with (40°C rise) Irms current

储存温度范围:

Component: –55°C to +165°C.
Tape and reel packaging: –55°C to +80°C

最高元件温度:

+165°C (ambient + temp rise)

故障率（FIT）/平均故障间隔时间（MTBF）:

See FIT/MTBF Calculations