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XGL6030 Series

Ultra-Low Loss Shielded Power Inductors

XGL6030 molded power inductors offer our lowest DC losses and extremely low AC losses for a wide range of DC-DC converters. Additional performance benefits include a wider range of inductance values and improved I_rms current ratings.

Industry's lowest DCR and ultra low AC losses over a wide frequency range
Superior current handling with soft saturation characteristics
AEC-Q200 Grade 1 (−40°C to +125°C)
Wide inductance range from 0.18 µH to 18 µH
RoHS-compliant, halogen free. 260°C compatible. Tin-silver (96.5/3.5) over copper terminations
COTS Plus tin-silver-copper and tin-lead terminations available

Need parts for space, military or other critical applications?
See Coilcraft AE512PGA Series

今すぐ購入:

部品番号

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個数	単価
1	$2.68
100	$2.35
200	$1.75
400	$1.06
1200	$0.83
2400	$0.72
5000	$0.65

大量のご注文または在庫のない商品については、お見積もりをご依頼ください。

Termination

E = Tin-silver (96.5/3.5) over copper

Packaging

C = 7" machine-ready reel

Tolerance

M = 20%

. 在庫あり、即日出荷可能.

サンプルを依頼:

部品番号

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デザイナーズキット:

キット	値	価格
C496	20 (3 of each)	$75.00
C509	49 (3 of each)	$125.00

仕様

Electrical specifications at 25°C.

部品番号 1	インダクタンス (µH) 2 (公差: ±20%)	DCR (mΩ) 3		SRF typ (MHz) 4	Isat (A) 5			Irms (A) 6
部品番号 1	インダクタンス (µH) 2 (公差: ±20%)	typ	max	SRF typ (MHz) 4	10% drop	20% drop	30% drop	20°C rise	40°C rise
XGL6030-650MEC	0.065	0.53	0.63	400	26.0	42.0	57.5	30.5	43.0
XGL6030-181MEC	0.18	1.0	1.2	140	17.5	29.5	43.0	25.3	34.7
XGL6030-221MEC	0.22	1.2	1.5	130	16.5	27.5	39.0	23.0	32.0
XGL6030-381MEC	0.38	2.0	2.4	72	12.5	20.5	29.0	19.8	28.0
XGL6030-471MEC	0.47	2.2	2.7	66	11.5	18.7	26.5	18.1	25.0
XGL6030-681MEC	0.68	2.9	3.5	52	9.2	15.3	22.0	15.8	22.5
XGL6030-821MEC	0.82	3.4	4.0	50	9.1	14.9	21.0	14.9	21.0
XGL6030-102MEC	1.0	4.2	4.9	42	7.5	12.4	17.7	13.0	18.1
XGL6030-122MEC	1.2	4.6	5.4	42	7.4	12.3	17.3	12.0	16.5
XGL6030-152MEC	1.5	6.2	7.3	35	6.3	10.3	14.5	10.4	15.0
XGL6030-182MEC	1.8	7.5	8.9	33	5.9	9.4	13.0	9.5	14.5
XGL6030-222MEC	2.2	8.7	10.3	28	5.4	8.7	12.2	8.5	12.0
XGL6030-332MEC	3.3	13.1	15.4	25	4.6	7.5	10.4	7.6	10.5
XGL6030-472MEC	4.7	17.5	21.0	19	3.8	6.1	8.6	7.2	10.0
XGL6030-562MEC	5.6	20.5	24.1	18	3.5	5.9	8.2	6.5	8.8
XGL6030-682MEC	6.8	25.1	29.5	16	3.2	5.2	7.3	6.0	8.2
XGL6030-822MEC	8.2	35.0	40.0	14	2.8	4.6	6.5	5.1	7.1
XGL6030-103MEC	10	38.0	44.0	13	2.7	4.4	6.2	5.0	7.0
XGL6030-123MEC	12	46.0	53.0	12	2.4	3.9	5.5	4.4	6.0
XGL6030-153MEC	15	62.1	72.0	10	2.1	3.4	4.6	3.9	5.2
XGL6030-183MEC	18	69.6	80.0	9.5	1.9	3.1	4.4	3.4	4.7

メモ

When ordering, please specify termination and packaging codes: e.g. XGL6030-183MEC
Inductance tested at 1 MHz, 0.1 Vrms, 0 Adc.
DCR measured at 25°C on a micro-ohmmeter. For other operating temperatures, use this DCR at Temperature calculator.
SRF measured using an Agilent/HP 4395A or equivalent.
Isat: DC current at 25°C that causes the specified inductance drop from its value without current.
Temperature derating curves.
Irms: Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings. Temperature derating curves.
Irms testing was performed on 0.75 inch wide × 0.25 inch thick copper traces in still air. Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions.

終端処理:

E = Halogen free component. RoHS compliant tin-silver over copper terminations.
T = RoHS tin-silver-copper (95.5/4/0.5). (Special order, added cost)
S = non-RoHS tin-lead (63/37). (Special order, added cost)

パッケージ:

C = 7″ machine-ready reel. EIA-481 embossed plastic tape (400 parts per reel). Quantities less than full reel available: in tape (not machine ready) or with leader and trailer ($25 charge).
D = 13″ machine-ready reel. EIA-481 embossed plastic tape (1500 parts per reel). Factory order only, not stocked.

環境

環境:

RoHS準拠 , ハロゲンフリー

周囲温度範囲:

–40°C to +125°C with (40°C rise) Irms current

保管温度範囲:

Component: –55°C to +165°C
Tape and reel packaging: –55°C to +80°C

最大部品温度:

+165°C (ambient + temp rise)

時間内の障害（FIT）/平均障害間隔（MTBF）:

See FIT/MTBF Calculations