For all soldering methods, the optimal reflow profile for a circuit board assembly is dependent on several factors other than just the Coilcraft component and the chosen solder paste, such as the size and layout of all components. Large parts may require higher temperatures or a longer preheat time, whereas smaller parts (0201, 0402) may require extra considerations to avoid damage to the components.
Following are general guidelines (See Table 1.) that should only be considered a starting point for development of a proper reflow profile that considers, at a minimum, part size, the specific customer-chosen solder alloy, and the PCB component population. No single reflow profile covers all possible circuit board designs.
RoHS | Units | |
---|---|---|
Preheat / Soak Temperature | 150 – 200 | °C |
Preheat / Soak Duration | 60 – 120 | seconds |
Ramp-up Rate | 3 | °C / second |
Typ. Reflow Temperature | 217 | °C |
Peak Temperature | 255 – 260 | °C |
Time Within 5 °C of Peak | 30 | seconds |
Time Above Reflow Temperature | 60 – 150 | seconds |
Ramp-down Rate | 6 | °C / second |
This typical reflow profile is provided only as a guide.