3D Model Datasheet

Flyback Transformers

for Microchip Grid-Connected Solar Micro Inverter

Developed for Microchip for their Grid-Connected Solar Microinverter using dsPIC
For 220 Vac applications, KA4823-BL has been replaced by KA4823-CL, which has a higher SRF and higher efficiency.
Listed on Bill of Material for Reference Design AN1338

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Count	Unit price
1	$17.81
100	$15.27
500	$11.02
1000	$9.59
2500	$8.23
5000	$7.53

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Typical Application

Works with Microchip AN1338

Part number	Input Voltage	Output	Fsw
JA4635-AL	22 V — 55 V	110 V	150 kHz
KA4823-CL	22 V — 55 V	220 V	150 kHz

Specifications

Electrical specifications at 25°C.

Part number 1 (Hover for schematics)	Inductance at 0A (µH) (Tolerance: ±10%)	Isat (A) 2	DCR max (Ω) 3		Leakage Inductance max (µH) 4	Turns Ratio 5	Isolation Voltage (Vrms) 6
Part number 1 (Hover for schematics)	Inductance at 0A (µH) (Tolerance: ±10%)	Isat (A) 2	Pri	Sec	Leakage Inductance max (µH) 4	Pri : Sec	Isolation Voltage (Vrms) 6
JA4635-AL	28	10.5	0.008	0.106	0.138	1 : 6	3000
KA4823-CL	28	10.5	0.008	0.472	0.115	1 : 12	3000

Notes

Inductance is measured at 150 kHz, 0.1 Vrms.
DC current at which the inductance drops 10% (typical) from its value without current.
DCR is with the secondary windings connected in parallel.
Leakage inductance is for the three windings of the primary with the secondary windings shorted.
Turns ratios are with the primary and secondary windings connected in parallel.
3000 Vrms, one minute primary to secondary isolation.

Termination:

RoHS-compliant. Tin-silver (96.5/3.5) over tin cover copper-plated steel wire terminations.

Environmental

Environmental:

RoHS compliant

Ambient temperature range:

–40°C to +85°C

Storage temperature range:

Component: –40°C to +85°C.
Tray packaging: –40°C to +80°C

Failures in Time (FIT) / Mean Time Between Failures (MTBF):

See FIT/MTBF Calculations

Schematics

Physical characteristics

General specification

Core Material:

Ferrite

Weight:

94.3 g

Packaging:

20 per tray

Soldering/Washing

Moisture Sensitivity Level (MSL):

1 (unlimited floor life at <30°C / 85% relative humidity)

Resistance to soldering heat:

Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles

Refer to Soldering Coilcraft Components before soldering.

PCB Washing:

Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. See Doc787_PCB_Washing.pdf.

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