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RA7040-AL

RoHS compliant

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Typical Application

Works with Texas Instruments UCC2897

Input Voltage Output 1 Power
Sec Aux
48 V 60 V 12 V , 13 A 12 V 150 W

Specifications

Electrical specifications at 25°C.

Part number
(Hover for schematics)
Inductance
at 0A (µH) 2
(Tolerance: ±20%)
DCR max (mΩ) 3 Leakage
Inductance
max (µH) 4
Turns Ratio Volt-time
product (V-µs) 5
Isolation
Voltage (Vrms) 6
Pri Sec Aux Pri : Sec : Aux
RA7040-AL 50 10.75 4.25 61.10 0.55 1 : 0.5 : 0.5 100 1500
Notes
  1. Output is of the secondary winding frmo pins 11 – 8. Output of the aux winding is 12 V.
  2. Inductance is for the primary, measured on Agilent/HP 4284A at 200 kHz, 0.5 Vrms, 0 Adc with primary windings connected in parallel.
  3. DCR for the primary is measured with the windings connected in parallel. DCR at 25°C. For other operating temperatures, use this DCR at Temperature calculator.
  4. Leakage Inductance is for the primary, measured at 200 kHz, 0.5 Vrms, 0 Adc with primary windings connected in parallel and all secondary pins shorted.
  5. Volt-time product is based on primary windings connected in parallel.
  6. 1500 Vrms, one minute isolation hipot) from primary to secondary.

Termination:

  • RoHS-compliant  260°C compatible. Matte tin over nickel over brass.
Environmental
Environmental:
RoHS compliant
Ambient temperature range:
–40°C to +125°C
Storage temperature range:
Component: –40°C to +125°C
Tray packaging: –40°C to +80°C
Maximum part temperature:
+165°C (ambient + temp rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Schematics

ra7040s.gif

Primary windings to be connected in parallel on the PC board.

Physical characteristics

ra7040d.gif

dims_inches_mm.gif

General specification

Core Material:
Ferrite
Weight:
12.7 g
Packaging:
36 per tray

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info

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