Datenblatt-Index

Anmelden

View:
Einführung
Technische Daten
Umwelt/Umgebung
Kennlinien
Physikalische Eigenschaften
Löten/Reinigen

Datasheet DCDC Tool

GA3199-AL Power Inductor

for ON Semiconductor NCP1654

RoHS-konform

• Designed for ON Semiconductor for their 300 Watt, wide mains, PFC stage, driven by the NCP1654 PFC Controller
• Shown as L1 on Application Note AND8324/D
• High inductance: 650 μH; high saturating current: 6.3 A

Jetzt kaufen:

Anzahl	Einzelpreis
1	$13,72
250	$11,13
500	$8,51
1000	$6,62
2500	$5,67
5000	$5,21

Für große Mengen oder nicht vorrätige Artikel bitte ein Angebot anfordern.

. Auf Lager, noch heute versandbereit.

Muster anfordern:

Technische Daten

Electrical specifications at 25°C.

Teilenummer	Induktivität (µH) 1 (Toleranz: ±10%)	DCR max (mΩ) 2	SRF typ (MHz) 3	Isat (A) 4			Irms (A)
Teilenummer	Induktivität (µH) 1 (Toleranz: ±10%)	DCR max (mΩ) 2	SRF typ (MHz) 3	10% drop	20% drop	30% drop	20°C rise	40°C rise
GA3199-AL	650	165	770	5,8	6,1	6,3	2,9	3,8

Hinweise

Inductance measured at 10 kHz, 0.1 Vrms, 0 Adc.
DCR measured at 25°C. For other operating temperatures, use this DCR at Temperature calculator.
SRF measured on an Agilent/ HP 4192A impedance analyzer or equivalent
Isat: DC current at 25°C that causes the specified inductance drop from its value without current. Temperature derating curves.

Verpackung:

20 per tray

Umwelt/Umgebung

Umwelt/Umgebung:

RoHS-konform

Umgebungstemperaturbereich:

–40°C to +85°C with (40°C rise) Irms current

Lagertemperaturbereich:

Component: –40°C to +125°C
Tray packaging: –40°C to +80°C

Maximale Bauteiltemperatur:

+95°C (ambient + temp rise)

Ausfälle pro Zeiteinheit (FIT) / Mittlere Ausfallzeit (MTBF):

See FIT/MTBF Calculations

Kennlinien

Inductance vs Current

Inductance vs Current

Physikalische Eigenschaften

Allgemeine Spezifikation

Kernmaterial:

Ferrite

Gewicht:

94 g

Verpackung:

20 per tray

Löten/Reinigen

Feuchteempfindlichkeitsstufe (MSL):

1 (unlimited floor life at <30°C / 85% relative humidity)

Löttemperaturbeständigkeit:

Refer to Doc 362 “Soldering Surface Mount Components” before soldering.

Vor dem Löten bitte den Beitrag Löten von Coilcraft-Bauelementen lesen.

Baugruppenreinigung:

Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info

Verwandte Produktfamilien

AGM,AGP,VER

Highest current at high inductance
Exceptionally low DC resistance

DMT

Toroidal shielded TH construction
High inductance and current

LPS

High performance in a low profile
High energy storage and low DC resistance

PS,FS

Highest SRF for their size
Magnetically shielded for low EMI

SER

Proven performance
Rugged SMT construction

XGL

Our latest innovation with lowest DCR
Lowest power consumption

LPZ

Higher inductance values than LPS series
Rugged construction -Some AEC-Q200

RFS

Rugged TH mount construction
Magnetic shielding minimizes EMI

SLR,SLC

Sub-milliohm, low-variation DCR
For multi-phase VRM/VRD/EVRD

XEL

Lower losses vs XAL
Additional sizes and inductance values

MLC

Soft saturation for high peak current
For low-voltage, high-current VRD/VRM

MSS/MOS

Low-loss / Flat inductance vs current
Wide range of industry-standard footprints

SPT

Flat top for surface mounting
Toroid winding for low EMI

XAL

Proven high performance
Benchmark molded power inductor

HCT

High current, low voltage toroid
Either horizontal or vertical mount

MVR

Original Construction for very low DCR
Low loss and soft saturation versions

XFL

Lowest profile in the X family
Height as low as 0.5mm

XAR

Unique Off-board Design
Perfect for modules

EPL

Low Profile
Cost Effective Design

PFL

Ultra small size
Significant current handling